Qualcomm Introduces Advanced Modem and Wi-Fi Chip with AI Integration
Qualcomm is among the numerous companies taking part in the ongoing Mobile World Congress 2024 in Barcelona. The company, founded in the United States, has unveiled its latest advancements, showcasing cutting-edge modems and Wi-Fi processors designed for upcoming high-end smartphones. Notable among these releases are the Snapdragon X80 5G Modem-RF and the FastConnect 7900 chips.
These components are designed to leverage artificial intelligence (AI) to improve and accelerate connection speeds.
The Snapdragon X80 is the seventh iteration of Qualcomm‘s 5G modem-antenna integration. This module includes six antennas and supports AI-driven mmWave range extension (for fixed wireless devices). This 5G Advanced chip also integrates a specialized tensor accelerator entirely dedicated to AI tasks. According to Qualcomm, the latter can significantly improve data transfer rates, reduce latency and improve location tracking coverage and accuracy, all while consuming less power.
The FastConnect 7900 integrates Wi-Fi 7 and Bluetooth UWB (ultra wide band), and here again AI is involved, allowing the chip to constantly monitor its performance and adapt in real time to different network conditions, thus ensuring a fast and reliable connection.
Note that usually Qualcomm’s latest modems and radio chips are incorporated into the next generation of Snapdragon 8 Gen 4 processors. In this case, this means that this X80 5G and FastConnect 7900 will be present in the Snapdragon 8 Gen 4 guru and therefore also in all high-end smartphones equipped with this SoC.
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